Printed Circuit Board (PCB) Layout Engin

JOB REQUIREMENTS: Printed Circuit Board (PCB) Layout Engineer –
HPE1US1179355EXTERNALENUS DESCRIPTION/RESPONSIBILITIES: Printed Circuit
Board (PCB) Layout Engineer This role has been designed as Hybrid
with an expectation that you will work on average 2-3 days per week from
an HPE office. Job Description: We are seeking an experienced Printed
Circuit Board (PCB) Layout Engineer to design complex Printed Circuit
Boards (PCB) for high performance computing systems. The PCB Design
Engineer will work independently to layout and help release cutting
edge, high speed PCBs into production. Responsibilities Designs Printed
Circuit Board layouts using computer aided design software, consistent
with electrical engineering circuit performance, signal integrity, and
EMI specifications, mechanical engineering form factor and thermal
requirements, and manufacturing requirements. Reads/interprets
schematics, system functionality and performance specifications, and the
company PCB design guidelines as necessary to complete printed circuit
board layouts. Determines PCB design approaches and parameters.
Influences design decisions related to the analysis and resolution of
system performance issues related to the printed circuit board layout.
#LI-Hybrid Additional Skills: Accountability, Accountability, Action
Planning, Active Learning (Inactive), Active Listening, Agile
Methodology, Agile Scrum Development, Analytical Thinking, Bias,
Coaching, Creativity, Critical Thinking, Cross-Functional Teamwork, Data
Analysis Management, Data Collection Management (Inactive), Data
Controls, Design, Design Thinking, Empathy, Follow-Through, Group
Problem Solving, Growth Mindset, Intellectual Curiosity (Inactive), Long
Term Planning, Managing Ambiguity { 5 more} States with Pay Range
Requirement The expected salary/wage range for a U.S. -based hire
filling this position is provided below. Actual offer may vary from this
range based upon geographic location, work experience,
education/training, and/or skill level. If this is a sales role, then
the listed salary range reflects combined base salary and target-level
sales compensation pay. If this is a non-sales role, then the listed
salary range reflects base salary only. Variable incentives may also be
offered. Information about employee benefits offered can be found at USD
Annual Salary: $111,000.00 – $255,500.00 HPE is an Equal Employment
Opportunity/ Veterans/Disabled/LGBT and Affirmative Action employer. We
are committed to diversity and building a team that represents a variety
of backgrounds, perspectives, and skills. We do not discriminate and all
decisions we make are made on the basis of qualifications, merit, and
business need. Our goal is to be one global diverse team that is
representative of our customers, in an inclusive environment where we
can continue to innovate and grow together. Please click here: Equal
Employment Opportunity . Hewlett Packard Enterprise is EEO F/M/Protected
Veteran/ Individual with Disabilities. HPE will comply with all
applicable laws related to employer use of arrest and conviction
records, including laws requiring employers to consider for employment
qualified applicants with criminal histories. . OTHER
EXPERIENCE AND QUALIFICATIONS: Education and Experience Associates
degree or equivalent technical degree 15 or more years experience
laying out complex, multi-layered, high speed printed circuit boards
Advanced knowledge in the use of ECAD software, particularly experience
with Cadence Allegro PCB Editor required Advanced knowledge of PCB
Design Guidelines and design constraints Have performed layout
studies and placement and helped drive sound architectural decisions
Have experience laying out boards with DDR4, PCIe Gen 4, high speed
SerDes, Ethernet, I2C, SPI, etc. Experience in high speed routing
techniques such as microvias, blind and buried vias, backdrilling, etc.
Experience working with PCB fabrication shops and PCA contact
manufacturers Experience with liquid cooled designs is a plus
Experience helping define ASIC package ball maps is a plus Experience
with industry standard form factors such as PCIe CEM and Open Compute
Project is a plus Experience creating symbols and managing symbol
libraries is a plus Knowledge and Skills Ability to read and
interpret schematics, datasheets, layout guidelines Ability to work
with and if necessary drive, engagements with design partners such
electrical engineers, mechanical engineers, signal integrity and power
integrity engineers, etc. Working knowledge of electronics including
signal and power integrity issues Understanding of EMC principals and
best practices to mitigate EMI In depth knowledge of Design
APPLICATION INSTRUCTIONS: Apply Online:
https://ars2.equest.com/?responseid=013ddae61e53ad20b7460231402ec5dd
Other: Applicants ONLY to apply via URL link provided!