Sr. Digital Microelectronics Engineering Section Lead

Job Description

FAST Labs is a world-class research organization. Our vision, We secure the future through fearless innovation, fuels our curiosity and propels our technical teams to take on never been done before challenges. FAST Labs advances science, develops technology, and delivers microelectronics products to solve the toughest challenges for our defense and commercial customers. FAST Labs defines the next generation of technology across BAE Systems Electronic Systems (ES) sector. We value internal and external partnerships and collaborate across a broad innovation ecosystem that includes DoD/IC/OGA labs and research teams, universities, small businesses and venture firms/accelerators all in service of developing advanced technologies to enable our nation s warfighting mission needs.

Position Summary

We are seeking a Senior Digital Microelectronics Design Engineering Manager to work within our Electronic Systems Mixed-Signal and Digital Integrated Circuit Capability Group leading teams of teams across multiple Business Areas. We are interested in candidates with leadership, project management, and custom and ASIC design experience, who have had a role in new development and/or established programs. Candidates must demonstrate strong technical aptitude and leadership skills. Experience leading high performing ASIC design teams and leads as part of a multi-disciplined engineering teams through all phases of an ASIC or FPGA development lifecycle is important, as the individual will be in a position to influence program execution, mentor engineers, and set the culture and goals for the organization.

In this Sr Digital Microelectronics Design Engineering Manager role you will make impacts in the following ways;

Serve as a second line discipline manager where you will lead digital microelectronics design engineering organization that delivers digital microelectronics design services to Electronics Systems programs.

Advancing the state of digital microelectronics by assessing and evaluating modern tools, design techniques, and hardware resources

Lead engineer managers and collaborate with peer leads to develop staffing strategies to meet the business needs and grow capabilities in critical skill areas identified for the business

Support the development of employees through coaching, training, mentorship, and career planning including providing employees with performance assessments for mid-year and end-of-year reviews

Support proposal efforts for microelectronics engineering to capture new business ensuring estimates meet acceptable schedule / budget risk targets

Oversee and ensure adherence to digital microelectronics design process through lifecycle phases including: design development, integration, test, and product support

Drive scope management through understanding of technical baselines, proposal positions, and execution plans

Serve as design review chair or assessor for development programs to ensure reviews meet hardware guidelines, and to ensure appropriate subject matter experts are engaged

Support key initiatives in business area or in discipline to meet yearly objectives and continuous improvement goals

Required Education, Experience, & Skills

Ability to obtain a Secret DOD Security Clearance and Bachelors Degree or higher required

Strong leadership skills with the ability to manage a group of 40 engineers across mix of logic design, verification, design for test, physical design, and product engineers.

Electrical/Computer engineering degree: BSE with 12 years experience or MSE and 10 years experience

Experience leading microelectronics projects from inception to fielded product

Hands-on experience in all phases of ASIC design, from planning and architecture, to implementation and testing, through coverage closure

Experience with EDA tools used for integrated circuit design flow

Motivated self-starter with leadership skills and ability to effectively work in a team environment

Experience working with multidiscipline engineering teams

Excellent problem-solving skills, judgment, and analytical capability

Preferred Education, Experience, & Skills

Active Secret DOD Security Clearance, Bachelors Degree or higher

Strong understanding of Product Lifecycle management processes

Demonstrated success managing all integrated circuit design aspects including requirements definition, planning, design, integration, test and coverage closure for complex microelectronics

Prior Project Engineer / Control Account Manager (CAM) experience

Experience in FPGA and/or ASIC development

Pay Information

Full-Time Salary Range: $147300 – $250400

Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience.

Employee Benefits: At BAE Systems, we support our employees in all aspects of their life, including their health and financial well-being. Regular employees scheduled to work 20 hours per week are offered: health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance. We also have an employee assistance program, a legal plan, and other perks including discounts on things like home, auto, and pet insurance. Our leave programs include paid time off, paid holidays, as well as other types of leave, including paid parental, military, bereavement, and any applicable federal and state sick leave. Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards. Other incentives may be available based on position level and/or job specifics.

Sr. Digital Microelectronics Engineering Section Lead

106781BR

EEO Career Site Equal Opportunity Employer. Minorities . females . veterans . individuals with disabilities . sexual orientation . gender identity . gender expression